Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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AR 18-HZW/TN
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2,519
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Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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2,315
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CNC Tech CONN IC DIP SOCKET 18POS GOLD - Active Tube -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
AR18-HZL/07-TT-R
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RFQ
2,028
In-stock
Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
123-43-318-41-001000
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RFQ
1,970
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-41-318-41-001000
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RFQ
1,059
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-1-18-003
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RFQ
3,531
In-stock
CNC Tech CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
123-43-318-41-801000
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RFQ
814
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-318-41-801000
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RFQ
2,550
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
WMS-180Z
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RFQ
650
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 18POS GOLD WMS Active Tube -40°C ~ 105°C Through Hole Solder Open Frame, Wash Away DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
110-47-318-41-001000
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RFQ
3,176
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
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RFQ
647
In-stock
CNC Tech CONN IC DIP SOCKET 18POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
115-47-318-41-003000
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RFQ
2,328
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-318-41-001000
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RFQ
1,201
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-318-41-001000
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RFQ
3,216
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-318-41-003000
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RFQ
1,379
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
AR-18-HZL/01-TT
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RFQ
3,969
In-stock
Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
614-43-318-31-012000
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RFQ
1,386
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
AR 18 HZL-TT
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RFQ
2,622
In-stock
Assmann WSW Components CONN IC DIP SOCKET 18POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
110-44-318-41-001000
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RFQ
940
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS TIN 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
SA183000
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RFQ
2,525
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 18POS GOLD SA Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
110-43-318-41-001000
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RFQ
1,740
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy