Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,828
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,784
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,639
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,002
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,595
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,010
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,398
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,180
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,355
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,594
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,608
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,050
In-stock
Amphenol FCI CONN SOCKET SIP 2POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 2 (1 x 2) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
1,421
In-stock
Amphenol FCI CONN SOCKET SIP 16POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (1 x 16) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,212
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (1 x 10) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,885
In-stock
Amphenol FCI CONN SOCKET SIP 30POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 30 (1 x 30) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,609
In-stock
Amphenol FCI CONN SOCKET SIP 14POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (1 x 14) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
1,374
In-stock
Amphenol FCI CONN SOCKET SIP 5POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 5 (1 x 5) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,942
In-stock
Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (1 x 32) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
673
In-stock
Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,304
In-stock
Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
1,468
In-stock
Amphenol FCI CONN SOCKET SIP 17POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 17 (1 x 17) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
1,640
In-stock
Amphenol FCI CONN SOCKET SIP 2POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 2 (1 x 2) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
3,087
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (1 x 10) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,434
In-stock
Amphenol FCI CONN SOCKET SIP 16POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (1 x 16) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,459
In-stock
Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
1,664
In-stock
Amphenol FCI CONN SOCKET SIP 11POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 11 (1 x 11) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
806
In-stock
Amphenol FCI CONN SOCKET SIP 2POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 2 (1 x 2) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
2,102
In-stock
Amphenol FCI CONN SOCKET SIP 32POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (1 x 32) Beryllium Copper Brass
Default Photo
RFQ
VIEW
RFQ
711
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,156
In-stock
Amphenol FCI CONN SOCKET SIP 12POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 12 (1 x 12) Beryllium Copper Brass