Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,973
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (1 x 12) Beryllium Copper - Brass
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2,002
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Amphenol FCI CONN SOCKET SIP 12POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,163
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Amphenol FCI CONN SOCKET SIP 12POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,156
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Amphenol FCI CONN SOCKET SIP 12POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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979
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Amphenol FCI CONN SOCKET SIP 12POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
643644-1
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2,129
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 12 (1 x 12) Beryllium Copper - Beryllium Copper
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1,202
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 12 (1 x 12) Beryllium Copper - Beryllium Copper
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687
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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2,243
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,981
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (1 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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1,886
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 12 (1 x 12) Beryllium Copper 20.0µin (0.51µm) Copper
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2,840
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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829
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Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,235
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 12POS GOLD 316 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,745
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Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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2,928
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,531
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 12POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy