Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
2-382712-1
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RFQ
3,477
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper
AR16-HZL-TT
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RFQ
3,557
In-stock
Assmann WSW Components CONN IC DIP SOCKET 16POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
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RFQ
1,442
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
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RFQ
3,101
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
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RFQ
1,075
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
AR16-HZL/07-TT
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RFQ
2,278
In-stock
Assmann WSW Components CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR16-HZL/01-TT
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RFQ
1,451
In-stock
Assmann WSW Components CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-641610-1
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RFQ
957
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete - - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper
2-641262-1
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RFQ
3,755
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Beryllium Copper