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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
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	10-2513-10H	RFQ VIEW	PDF RFQ	3,953 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass
	02-2513-10	RFQ VIEW	PDF RFQ	1,448 In-stock	Aries Electronics	CONN IC DIP SOCKET 2POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	2 (1 x 2)	Beryllium Copper	200.0µin (5.08µm)	Brass
	06-2513-10H	RFQ VIEW	PDF RFQ	2,032 In-stock	Aries Electronics	CONN IC DIP SOCKET 6POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	6 (2 x 3)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-2513-10	RFQ VIEW	PDF RFQ	926 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	06-2513-10	RFQ VIEW	PDF RFQ	3,226 In-stock	Aries Electronics	CONN IC DIP SOCKET 6POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	6 (2 x 3)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-2513-10T	RFQ VIEW	PDF RFQ	3,921 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	06-2513-10T	RFQ VIEW	PDF RFQ	3,961 In-stock	Aries Electronics	CONN IC DIP SOCKET 6POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	6 (2 x 3)	Beryllium Copper	200.0µin (5.08µm)	Brass
	10-2513-10	RFQ VIEW	PDF RFQ	1,737 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass
	08-2513-10H	RFQ VIEW	PDF RFQ	2,518 In-stock	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	8 (2 x 4)	Beryllium Copper	200.0µin (5.08µm)	Brass
	10-2513-10T	RFQ VIEW	PDF RFQ	1,140 In-stock	Aries Electronics	CONN IC DIP SOCKET 10POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)	Brass

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