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39 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,912
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,364
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 12 (2 x 6) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,704
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,888
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,692
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,049
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 12 (2 x 6) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,569
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,647
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,127
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
602
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,911
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 12 (2 x 6) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,259
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,119
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
852
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,651
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
888
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
843
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,215
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,860
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,284
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,447
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,740
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,188
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,022
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,963
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,925
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
905
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,573
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,512
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,870
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 12POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 12 (2 x 6) | Beryllium Copper | - | Brass | |||
