Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,047
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Copper
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3,962
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS TIN 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper - Copper
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1,863
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TIN 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 24 (2 x 12) Beryllium Copper - Copper
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1,404
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Nickel
110-43-324-41-801000
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RFQ
1,714
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-320-41-801000
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RFQ
2,476
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-43-316-31-012000
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RFQ
3,310
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
816-AG12D-ES-LF
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RFQ
3,487
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Copper
115-43-328-41-001000
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RFQ
1,751
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-43-316-41-001000
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RFQ
2,480
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-316-41-003000
RFQ
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RFQ
1,685
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-41-318-41-001000
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RFQ
1,059
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-314-41-801000
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861
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-328-41-003000
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RFQ
2,159
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-43-324-41-001000
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RFQ
3,896
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-324-41-001000
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RFQ
1,843
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-43-314-41-003000
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RFQ
1,310
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-41-320-41-001000
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1,391
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-43-316-41-001000
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RFQ
3,865
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-43-328-31-012000
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RFQ
1,529
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,311
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Beryllium Copper
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RFQ
3,999
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper - Copper
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1,438
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 6 (2 x 3) Beryllium Copper - Beryllium Copper
110-47-328-41-001000
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RFQ
755
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-43-308-41-001000
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RFQ
3,646
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-43-324-31-012000
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RFQ
1,563
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-43-318-41-801000
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RFQ
2,550
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-47-324-41-001000
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RFQ
3,807
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
111-47-316-41-001000
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RFQ
3,580
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-47-316-41-001000
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RFQ
3,321
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy