Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,762
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Preci-Dip CONN IC DIP SOCKET 20POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (2 x 10) Beryllium Copper - Brass
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1,099
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Preci-Dip CONN IC DIP SOCKET 22POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper - Brass
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3,405
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
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1,734
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Preci-Dip CONN IC DIP SOCKET 24POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 24 (2 x 12) Beryllium Copper - Brass
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957
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Preci-Dip CONN IC DIP SOCKET 28POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
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941
In-stock
Preci-Dip CONN IC DIP SOCKET 20POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (2 x 10) Beryllium Copper - Brass
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2,569
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Preci-Dip CONN IC DIP SOCKET 12POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
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699
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Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
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3,031
In-stock
Preci-Dip CONN IC DIP SOCKET 8POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 8 (2 x 4) Beryllium Copper - Brass
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2,807
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
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703
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Preci-Dip CONN IC DIP SOCKET 6POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper - Brass
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1,817
In-stock
Preci-Dip CONN IC DIP SOCKET 8POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 8 (2 x 4) Beryllium Copper - Brass
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2,590
In-stock
Preci-Dip CONN IC DIP SOCKET 6POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper - Brass
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2,042
In-stock
Preci-Dip CONN IC DIP SOCKET 8POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 8 (2 x 4) Beryllium Copper - Brass
614-43-316-31-012000
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3,310
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
614-43-328-31-012000
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1,529
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,103
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
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854
In-stock
Preci-Dip CONN IC DIP SOCKET 22POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 22 (2 x 11) Beryllium Copper - Brass
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3,032
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Preci-Dip CONN IC DIP SOCKET 28POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 28 (2 x 14) Beryllium Copper - Brass
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3,225
In-stock
Preci-Dip CONN IC DIP SOCKET 24POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 24 (2 x 12) Beryllium Copper - Brass
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2,000
In-stock
Preci-Dip CONN IC DIP SOCKET 14POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 14 (2 x 7) Beryllium Copper - Brass
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2,119
In-stock
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (2 x 6) Beryllium Copper - Brass
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686
In-stock
Preci-Dip CONN IC DIP SOCKET 16POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 16 (2 x 8) Beryllium Copper - Brass
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3,689
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
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3,215
In-stock
Preci-Dip CONN IC DIP SOCKET 12POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (2 x 6) Beryllium Copper - Brass
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744
In-stock
Preci-Dip CONN IC DIP SOCKET 14POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 14 (2 x 7) Beryllium Copper - Brass
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2,279
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
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3,726
In-stock
Preci-Dip CONN IC DIP SOCKET 8POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 8 (2 x 4) Beryllium Copper - Brass
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RFQ
1,005
In-stock
Preci-Dip CONN IC DIP SOCKET 28POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 28 (2 x 14) Beryllium Copper - Brass
614-43-324-31-012000
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RFQ
1,563
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass Alloy