- Part Status :
- Operating Temperature :
- Termination :
- Housing Material :
-
- Plastic (1)
- Polyamide (PA46), Nylon 4/6 (2)
- Polyamide (PA46), Nylon 4/6, Glass Filled (36)
- Polybutylene Terephthalate (PBT) (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (20)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (62)
- Polyester, Glass Filled (5)
- Thermoplastic, Glass Filled (2)
- Thermoplastic, Polyester (8)
- Thermoplastic, Polyester, Glass Filled (1)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
146 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,477
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,176
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,557
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,658
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,442
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 16POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,101
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,075
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,278
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,451
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
957
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | - | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,755
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
3,412
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,501
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,912
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,215
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
3,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,643
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,280
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,890
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,203
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,221
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 146 | Active | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,533
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,571
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS TIN | ICO | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,513
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,030
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,966
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,342
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,432
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 122 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,619
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,317
In-stock
|
CNC Tech | CONN IC DIP SOCKET 16POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | - | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
