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46 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
1,593
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,182
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
891
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,048
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,450
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
792
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
3,121
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
1,427
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,642
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
3,962
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
2,993
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
2,660
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
2,490
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
2,157
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
676
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,364
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,368
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,574
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
3,678
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
2,345
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 4POS TIN | - | Active | Bulk | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
3,750
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
2,092
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
3,068
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
1,160
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
3,077
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
1,940
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
3,349
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
2,082
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
767
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass | ||||
VIEW |
2,091
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 4POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 4 (2 x 2) | Beryllium Copper | - | Brass |