Contact Finish - Mating :
Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,828
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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1,472
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 4POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon, Glass Filled - Gold - 4 (Round) Beryllium Copper - - Brass
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3,043
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Obsolete - - Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold Flash 10 (1 x 10) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
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3,654
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 8POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon - Gold - 8 (Round) Copper Alloy - - Copper Alloy
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645
In-stock
Amphenol FCI CONN SOCKET SIP 2POS TIN - Obsolete Tape & Reel (TR) - Surface Mount Solder Closed Frame SIP Polyamide (PA), Nylon 0.100" (2.54mm) Tin 200.0µin (5.08µm) 2 (1 x 2) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
54020-84030LF
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1,886
In-stock
Amphenol FCI CONN SOCKET PLCC 84POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin 100.0µin (2.54µm) 84 (4 x 21) Copper Alloy 0.050" (1.27mm) 100.0µin (2.54µm) Copper Alloy
54020-52030LF
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3,221
In-stock
Amphenol FCI CONN SOCKET PLCC 52POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin 100.0µin (2.54µm) 52 (4 x 13) Copper Alloy 0.050" (1.27mm) 100.0µin (2.54µm) Copper Alloy
54020-68030LF
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1,455
In-stock
Amphenol FCI CONN SOCKET PLCC 68POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin 100.0µin (2.54µm) 68 (4 x 17) Copper Alloy 0.050" (1.27mm) 100.0µin (2.54µm) Copper Alloy
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3,410
In-stock
Amphenol FCI CONN SOCKET PLCC 52POS TIN - Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin 150.0µin (3.81µm) 52 (4 x 13) Phosphor Bronze 0.050" (1.27mm) 150.0µin (3.81µm) Phosphor Bronze
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3,928
In-stock
Preci-Dip CONN SOCKET PLCC 84POS TIN 540 Obsolete Tape & Reel (TR) - Surface Mount Solder Closed Frame PLCC Polyphenylene Sulfide (PPS) 0.050" (1.27mm) Tin - 84 (4 x 21) Phosphor Bronze 0.100" (2.54mm) - Phosphor Bronze
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1,547
In-stock
Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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3,573
In-stock
Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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728
In-stock
Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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3,185
In-stock
Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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1,890
In-stock
Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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1,060
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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3,934
In-stock
Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) 196.9µin (5.00µm) Brass
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3,280
In-stock
CNC Tech CONN SOCKET PLCC 84POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 84 (4 x 21) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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2,423
In-stock
CNC Tech CONN SOCKET PLCC 68POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 68 (4 x 17) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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3,862
In-stock
CNC Tech CONN SOCKET PLCC 52POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 52 (4 x 13) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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3,083
In-stock
CNC Tech CONN SOCKET PLCC 44POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 44 (4 x 11) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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894
In-stock
CNC Tech CONN SOCKET PLCC 32POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 32 (4 x 8) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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1,759
In-stock
CNC Tech CONN SOCKET PLCC 28POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 28 (4 x 7) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
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2,980
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CNC Tech CONN SOCKET PLCC 20POS TIN - Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame PLCC Polybutylene Terephthalate (PBT), Glass Filled 0.050" (1.27mm) Tin - 20 (4 x 5) Phosphor Bronze 0.050" (1.27mm) - Phosphor Bronze
10-18-2031
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3,670
In-stock
Molex, LLC CONN SOCKET TRANSIST TO-220 3POS 4038 Obsolete - - Through Hole Solder Closed Frame Transistor, TO-220 Polyester, Glass Filled 0.100" (2.54mm) Tin - 3 (Rectangular) Brass 0.100" (2.54mm) 100.0µin (2.54µm) Brass
0009483031
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2,439
In-stock
Molex, LLC CONN SOCKET TRANSIST TO-220 3POS - Obsolete Bulk -40°C ~ 80°C Through Hole Solder Closed Frame Transistor, TO-220 Polyamide (PA66), Nylon 6/6 - Tin 100.0µin (2.54µm) 3 (Rectangular) Brass - 100.0µin (2.54µm) Brass
28-516-10
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2,644
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
24-516-10
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1,927
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
40-516-10
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3,434
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Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
C8140-04
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2,107
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Aries Electronics CONN IC DIP SOCKET 40POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze