Contact Finish - Mating :
Contact Finish Thickness - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,828
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZL-TT
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2,541
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Assmann WSW Components CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
28-516-10
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2,644
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,897
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Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,492
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Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,449
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,228
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,010
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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2,069
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,749
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper - Beryllium Copper
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972
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3M CONN IC DIP SOCKET 28POS TIN 4800 Obsolete Tube -25°C ~ 85°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 35.4µin (0.90µm) 28 (2 x 14) Phosphor Bronze 35.0µin (0.90µm) Phosphor Bronze
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961
In-stock
3M CONN IC DIP SOCKET 28POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
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3,730
In-stock
3M CONN IC DIP SOCKET 28POS TIN ICO Obsolete Tube -65°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
1-390262-2
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3,245
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole, Right Angle, Vertical Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
1-390261-9
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2,614
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin 60.0µin (1.52µm) 28 (2 x 14) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
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3,081
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole, Right Angle, Vertical Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
AR28-HZL/7/07-TT
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1,528
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZL/07-TT
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RFQ
2,074
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,525
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,428
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Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-641615-1
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RFQ
863
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper - Beryllium Copper
2-641267-3
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RFQ
792
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
2-641267-1
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RFQ
1,056
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper - Beryllium Copper
2-641615-3
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RFQ
840
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
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3,922
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Beryllium Copper - Beryllium Copper
2-382568-8
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RFQ
3,405
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
2-382467-3
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RFQ
3,149
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
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1,744
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,553
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
3,806
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper