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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	36-6556-10	RFQ VIEW	PDF RFQ	3,808 In-stock	Aries Electronics	CONN IC DIP SOCKET 36POS GOLD		6556	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Tin	36 (2 x 18)	Beryllium Copper	200.0µin (5.08µm)	Brass
	115-87-636-41-003101	RFQ VIEW	PDF RFQ	743 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		115	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	114-87-636-41-117101	RFQ VIEW	PDF RFQ	3,519 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		114	Active	Tube	-55°C ~ 125°C	Surface Mount	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	110-87-636-41-005101	RFQ VIEW	PDF RFQ	2,842 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		110	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	115-87-636-41-001101	RFQ VIEW	PDF RFQ	2,826 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		115	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	36-1518-00	RFQ VIEW	PDF RFQ	1,222 In-stock	Aries Electronics	CONN IC DIP SOCKET 36POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	36 (2 x 18)	Beryllium Copper	200.0µin (5.08µm)	Brass
	36-1518-10T	RFQ VIEW	PDF RFQ	3,296 In-stock	Aries Electronics	CONN IC DIP SOCKET 36POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	36 (2 x 18)	Beryllium Copper	200.0µin (5.08µm)	Brass
	110-83-636-41-105101	RFQ VIEW	PDF RFQ	3,374 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		110	Active	Tube	-55°C ~ 125°C	Surface Mount	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	36-1518-10	RFQ VIEW	PDF RFQ	2,521 In-stock	Aries Electronics	CONN IC DIP SOCKET 36POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	36 (2 x 18)	Beryllium Copper	200.0µin (5.08µm)	Brass
	114-83-636-41-117101	RFQ VIEW	PDF RFQ	3,712 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		114	Active	Tube	-55°C ~ 125°C	Surface Mount	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	115-83-636-41-001101	RFQ VIEW	PDF RFQ	2,080 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		115	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	36-1518-10H	RFQ VIEW	PDF RFQ	2,070 In-stock	Aries Electronics	CONN IC DIP SOCKET 36POS GOLD		518	Active	Bulk	-	Through Hole	Solder	Open Frame	DIP, 0.2" (5.08mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	36 (2 x 18)	Beryllium Copper	200.0µin (5.08µm)	Brass
	110-83-636-41-005101	RFQ VIEW	PDF RFQ	1,629 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		110	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	110-83-636-41-001101	RFQ VIEW	PDF RFQ	1,048 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		110	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	110-87-636-41-105101	RFQ VIEW	PDF RFQ	2,403 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		110	Active	Tube	-55°C ~ 125°C	Surface Mount	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	115-83-636-41-003101	RFQ VIEW	PDF RFQ	3,388 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		115	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Tin	36 (2 x 18)	Beryllium Copper	-	Brass
	110-87-636-41-001101	RFQ VIEW	PDF RFQ	911 In-stock	Preci-Dip	CONN IC DIP SOCKET 36POS GOLD		110	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	0.100" (2.54mm)	Gold	Flash	Tin	36 (2 x 18)	Beryllium Copper	-	Brass

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