- Part Status :
- Packaging :
- Operating Temperature :
- Mounting Type :
- Housing Material :
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- Liquid Crystal Polymer (LCP) (2)
- Plastic (1)
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (13)
- Polybutylene Terephthalate (PBT) (6)
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (14)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (30)
- Polyester, Glass Filled (8)
- Thermoplastic, Glass Filled (1)
- Thermoplastic, Polyester (7)
- Thermoplastic, Polyester, Glass Filled (1)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
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90 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
3,477
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,557
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,442
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 16POS TIN | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,101
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,075
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,943
In-stock
|
3M | CONN IC DIP SOCKET 16POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,718
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 16 (2 x 8) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
2,888
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS TIN | - | Obsolete | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,278
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,451
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,130
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | - | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,495
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 110 | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,571
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS TIN | ICO | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,030
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,732
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,644
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,753
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | Flash | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,459
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
736
In-stock
|
CNC Tech | CONN IC DIP SOCKET 16POS GOLD | - | Active | Tube | -40°C ~ 105°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | - | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,806
In-stock
|
CNC Tech | CONN IC DIP SOCKET 16POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 16 (2 x 8) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
3,487
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | 16 (2 x 8) | Beryllium Copper | - | Copper | |||
|
VIEW |
2,480
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 111 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,685
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,526
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,537
In-stock
|
CNC Tech | CONN IC DIP SOCKET 16POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole, Kinked Pin | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 16 (2 x 8) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
|
VIEW |
1,686
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,605
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,138
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 16POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,178
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
