Contact Material - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
GLOBAL STOCKS
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1,269
In-stock
Harwin Inc. CONNECTOR D01-993 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 32 (1 x 32) Brass -
10-18-2031
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3,670
In-stock
Molex, LLC CONN SOCKET TRANSIST TO-220 3POS 4038 Obsolete - - Through Hole Solder Closed Frame Transistor, TO-220 Polyester, Glass Filled 0.100" (2.54mm) Tin 3 (Rectangular) Brass 100.0µin (2.54µm)
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2,812
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 500 Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin 28 (2 x 14) Beryllium Copper -
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726
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN 500 Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin 8 (2 x 4) Beryllium Copper -
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RFQ
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RFQ
1,857
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Tin 381 (18 x 18) Beryllium Copper -
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RFQ
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RFQ
2,567
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Tin 361 (18 x 18) Beryllium Copper -
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RFQ
1,043
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 241 (18 x 18) Beryllium Copper -
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RFQ
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RFQ
2,404
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 800 Obsolete Tube - Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin 28 (2 x 14) Beryllium Copper -
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RFQ
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3,541
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 800 Obsolete Tube - Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin 14 (2 x 7) Beryllium Copper -
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1,556
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN 800 Obsolete Tube - Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin 8 (2 x 4) Beryllium Copper -
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RFQ
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RFQ
1,241
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 169 (17 x 17) Beryllium Copper -
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RFQ
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RFQ
1,698
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 144 (15 x 15) Beryllium Copper -
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RFQ
VIEW
RFQ
1,612
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 144 (12 x 12) Beryllium Copper -
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RFQ
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RFQ
3,074
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Tin 296 (19 x 19) Beryllium Copper -
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RFQ
860
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 132 (14 x 14) Beryllium Copper -
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RFQ
VIEW
RFQ
3,226
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 132 (13 x 13) Beryllium Copper -
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RFQ
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RFQ
1,620
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 145 (15 x 15) Beryllium Copper -
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RFQ
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RFQ
1,835
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 225 (18 x 18) Beryllium Copper -
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887
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 124 (13 x 13) Beryllium Copper -
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RFQ
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RFQ
1,677
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 133 (14 x 14) Beryllium Copper -
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RFQ
3,196
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 191 (18 x 18) Beryllium Copper -
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RFQ
1,504
In-stock
Preci-Dip PGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 56 (9 x 9) Beryllium Copper -
4594
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729
In-stock
Keystone Electronics CONN SOCKET TRANSIST TO100 10POS - Active Bulk - Chassis Mount Solder Closed Frame Transistor, TO-100 Polyester, Glass Filled - Tin 10 (Round) Brass -
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2,525
In-stock
Aavid, Thermal Division of Boyd Corporation CONN TRANSIST TO-3 4POS TIN 8180 Active Bulk - Through Hole Solder Closed Frame Transistor, TO-3 Phenolic - Tin 4 (Oval) Brass -
4608
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RFQ
1,012
In-stock
Keystone Electronics CONN TRANSIST TO-3 3POS TIN - Active Bulk - Chassis Mount Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Tin 3 (Rectangular) Brass -
4618
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2,042
In-stock
Keystone Electronics CONN TRANSIST TO-3 3POS TIN - Active Bulk - Chassis Mount Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Tin 3 (Rectangular) Brass -
4609
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RFQ
3,999
In-stock
Keystone Electronics CONN TRANSIST TO-3 3POS TIN - Active Bulk - Chassis Mount Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Tin 3 (Rectangular) Brass -
4607
RFQ
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RFQ
2,063
In-stock
Keystone Electronics CONN TRANSIST TO-3 3POS TIN - Active Bulk - Chassis Mount Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Tin 3 (Rectangular) Brass -
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1,811
In-stock
Samtec Inc. CONN IC DIP SOCKET 40POS TIN ICA Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin 40 (2 x 20) Beryllium Copper -
4603
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RFQ
1,383
In-stock
Keystone Electronics CONN TRANSIST TO-3 3POS TIN - Active Bulk - Chassis Mount Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Tin 3 (Oval) Brass -