Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post
GLOBAL STOCKS
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RFQ
1,883
In-stock
Molex, LLC CONN SOCKET LGA 1156POS GOLD 47596 Obsolete Tray Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1156 (40 x 40) Copper Alloy 0.036" (0.91mm)
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RFQ
3,527
In-stock
Molex, LLC CONN SOCKET LGA 1155POS GOLD 47596 Obsolete Tray Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1155 (40 x 40) Copper Alloy 0.036" (0.91mm)
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RFQ
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RFQ
1,801
In-stock
Molex, LLC CONN SOCKET LGA 1156POS GOLD 47596 Obsolete Tray Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1156 (40 x 40) Copper Alloy 0.036" (0.91mm)
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RFQ
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RFQ
1,313
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1156POS GOLD - Active Tray Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1156 (34 x 34) Copper Alloy 0.039" (1.00mm)
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RFQ
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RFQ
3,934
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1155POS GOLD - Active Bulk Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1155 (40 x 40) Copper Alloy 0.036" (0.91mm)
2134928-1
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RFQ
1,399
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1150POS GOLD - Active Bulk Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1150 Copper Alloy 0.036" (0.91mm)
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RFQ
3,743
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1151POS GOLD - Active Bulk Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1151 Copper Alloy 0.036" (0.91mm)