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35 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
806
In-stock
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Amphenol FCI | CONN SOCKET SIP 2POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,974
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,021
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
3,368
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
3,959
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,256
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,339
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,910
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,993
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
659
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,503
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,477
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,539
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,218
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,874
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
729
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,366
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,448
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,359
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
2,211
In-stock
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Aries Electronics | CONN SOCKET SIP 2POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
3,809
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,197
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,399
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,280
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,353
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 2 (1 x 2) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,201
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,769
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
800
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,618
In-stock
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Aries Electronics | CONN IC DIP SOCKET 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
773
In-stock
|
Aries Electronics | CONN SOCKET SIP 2POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass |