Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,249
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,075
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
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RFQ
2,772
In-stock
Amphenol FCI CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,228
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
915
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,500
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
AR20-HZL/01-TT-R
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RFQ
3,886
In-stock
Assmann WSW Components CONN IC DIP SOCKET 20POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR48-HZL/01-TT
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RFQ
1,307
In-stock
Assmann WSW Components CONN IC DIP SOCKET 48POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZL/01-TT
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RFQ
2,595
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR32-HZL/01-TT
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RFQ
1,702
In-stock
Assmann WSW Components CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,525
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
VIEW
RFQ
3,428
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZL/7/01-TT
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RFQ
769
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZL/01-TT
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RFQ
3,977
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR20-HZL/01-TT
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RFQ
2,289
In-stock
Assmann WSW Components CONN IC DIP SOCKET 20POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR16-HZL/01-TT
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VIEW
RFQ
1,451
In-stock
Assmann WSW Components CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR14-HZL/01-TT
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VIEW
RFQ
1,628
In-stock
Assmann WSW Components CONN IC DIP SOCKET 14POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZL/01-TT
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RFQ
3,703
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
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RFQ
1,576
In-stock
Assmann WSW Components CONN IC DIP SOCKET 6POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
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RFQ
3,818
In-stock
Aries Electronics CONN IC DIP SOCKET 60POS GOLD 518 Obsolete Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 60 (2 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
901
In-stock
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,974
In-stock
Aries Electronics CONN SOCKET SIP 2POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
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RFQ
2,794
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,932
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
3,970
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,472
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,703
In-stock
Samtec Inc. DIP SOCKETS ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper - Brass
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RFQ
1,799
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
64-9518-10
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RFQ
2,817
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,597
In-stock
Aries Electronics CONN IC DIP SOCKET 34POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 34 (2 x 17) Beryllium Copper 200.0µin (5.08µm) Brass