- Part Status :
- Packaging :
- Operating Temperature :
- Type :
-
- BGA (69)
- DIP, 0.2" (5.08mm) Row Spacing (27)
- DIP, 0.3" (7.62mm) Row Spacing (157)
- DIP, 0.4" (10.16mm) Row Spacing (14)
- DIP, 0.6" (15.24mm) Row Spacing (165)
- DIP, 0.9" (22.86mm) Row Spacing (42)
- DIP, ZIF (ZIP) (16)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (48)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (31)
- PGA (23)
- SIP (32)
- Zig-Zag (1)
- Housing Material :
-
- FR4 Epoxy Glass (92)
- Polyamide (PA46), Nylon 4/6 (66)
- Polyamide (PA46), Nylon 4/6, Glass Filled (348)
- Polybutylene Terephthalate (PBT), Glass Filled (7)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (7)
- Polyester (1)
- Polyphenylene Sulfide (PPS), Glass Filled (96)
- Thermoplastic (4)
- Thermoplastic, Polyester, Glass Filled (1)
- Pitch - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (2)
- 10 (2 x 5) (29)
- 11 (1 x 11) (2)
- 12 (1 x 12) (1)
- 12 (2 x 6) (14)
- 13 (1 x 13) (1)
- 14 (1 x 14) (2)
- 14 (2 x 7) (35)
- 15 (1 x 15) (3)
- 16 (1 x 16) (3)
- 16 (2 x 8) (33)
- 18 (2 x 9) (23)
- 192 (16 x 16) (4)
- 2 (1 x 2) (5)
- 20 (1 x 20) (5)
- 20 (2 x 10) (24)
- 21 (1 x 21) (1)
- 22 (2 x 11) (14)
- 24 (2 x 12) (38)
- 255 (16 x 16) (4)
- 256 (16 x 16) (4)
- 256 (20 x 20) (4)
- 26 (2 x 13) (7)
- 272 (20 x 20) (4)
- 28 (2 x 14) (40)
- 292 (20 x 20) (4)
- 3 (1 x 3) (2)
- 30 (2 x 15) (17)
- 32 (1 x 32) (1)
- 32 (2 x 16) (33)
- 34 (2 x 17) (7)
- 352 (26 x 26) (4)
- 356 (26 x 26) (4)
- 357 (19 x 19) (4)
- 36 (2 x 18) (17)
- 360 (19 x 19) (4)
- 38 (2 x 19) (7)
- 388 (26 x 26) (4)
- 4 (1 x 4) (1)
- 4 (2 x 2) (2)
- 40 (2 x 20) (49)
- 400 (20 x 20) (4)
- 42 (2 x 21) (7)
- 420 (26 x 26) (4)
- 432 (31 x 31) (4)
- 44 (2 x 22) (6)
- 456 (26 x 26) (4)
- 48 (2 x 24) (27)
- 480 (29 x 29) (4)
- 5 (1 x 5) (1)
- 50 (2 x 25) (5)
- 500 (30 x 30) (4)
- 504 (29 x 29) (4)
- 52 (2 x 26) (1)
- 520 (31 x 31) (4)
- 560 (33 x 33) (4)
- 576 (30 x 30) (4)
- 6 (1 x 6) (1)
- 6 (2 x 3) (16)
- 60 (2 x 30) (5)
- 600 (35 x 35) (4)
- 64 (2 x 32) (5)
- 652 (35 x 35) (4)
- 7 (1 x 7) (2)
- 8 (1 x 8) (2)
- 8 (2 x 4) (36)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Applied Filters :
625 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
VIEW |
1,547
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
3,573
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
728
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
3,185
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
1,890
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
1,060
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
3,934
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
2,641
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Lo-PRO®file, C93 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | ||||
VIEW |
2,644
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Tin | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
VIEW |
1,927
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
VIEW |
3,434
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS TIN | 516 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
VIEW |
689
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,467
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,785
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,438
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
800
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,345
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,708
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,819
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
604
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,836
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,541
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,316
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,268
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 480 (29 x 29) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,295
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,927
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 504 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,266
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Brass | 10.0µin (0.25µm) | Brass | ||||
VIEW |
2,073
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
706
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Brass | 10.0µin (0.25µm) | Brass |