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10 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
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1,214
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,395
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,882
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,195
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
2,827
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
3,144
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
1,148
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
3,771
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
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VIEW |
1,352
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | -55°C ~ 250°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyetheretherketone (PEEK), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | |||
|
VIEW |
1,195
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Copper |