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9 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
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VIEW |
1,685
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | - | Bronze | |||
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|
VIEW |
2,192
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
729
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,685
In-stock
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Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,156
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
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|
VIEW |
2,313
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
818
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,068
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS TIN | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,555
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS TIN | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
