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8 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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VIEW |
1,556
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 800 | Obsolete | Tube | - | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
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VIEW |
1,489
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Active | - | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,192
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
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VIEW |
729
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,156
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
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VIEW |
2,313
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
818
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
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VIEW |
2,068
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS TIN | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |