Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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3,999
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper Copper
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RFQ
1,558
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper Brass
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RFQ
2,782
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper Brass
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RFQ
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RFQ
1,049
In-stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper Brass
Default Photo
RFQ
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RFQ
2,319
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper Copper
DILB8P-223TLF
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RFQ
3,362
In-stock
Amphenol FCI CONN IC DIP SOCKET 8POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) 8 (2 x 4) Copper Alloy Copper Alloy