- Part Status :
- Packaging :
- Operating Temperature :
- Termination :
- Features :
- Housing Material :
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- Liquid Crystal Polymer (LCP) (4)
- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (11)
- Polyamide (PA46), Nylon 4/6, Glass Filled (11)
- Polybutylene Terephthalate (PBT) (2)
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (6)
- Polyester, Glass Filled (7)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (1)
- Thermoplastic, Polyester (5)
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
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58 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
3,115
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,601
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
3,255
In-stock
|
3M | CONN IC DIP SOCKET 8POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
843
In-stock
|
3M | CONN IC DIP SOCKET 8POS TIN | ICO | Obsolete | Tube | -65°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
726
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 500 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,140
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 8 (2 x 4) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
VIEW |
2,626
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,556
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | 800 | Obsolete | Tube | - | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,672
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
1,685
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | - | Bronze | |||
|
|
VIEW |
1,607
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,073
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,839
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,118
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,489
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Active | - | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
804
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,747
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | 8 (2 x 4) | Phosphor Bronze | 50.0µin (1.27µm) | Phosphor Bronze | |||
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|
VIEW |
2,463
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,159
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,945
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,411
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,191
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,086
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,192
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | iCF | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Liquid Crystal Polymer (LCP) | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
729
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN | - | Active | Tape & Reel (TR) | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
850
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,455
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,685
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
930
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,069
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
