Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
AR18-HZL-TT
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3,872
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Assmann WSW Components CONN IC DIP SOCKET 18POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
C8118-04
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1,624
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Aries Electronics CONN IC DIP SOCKET 18POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,797
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Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,326
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Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,873
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Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,461
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Aries Electronics CONN IC DIP SOCKET 18POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
214-44-318-01-670800
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3,023
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS TIN 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,633
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Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
1,428
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,460
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Aries Electronics CONN IC DIP SOCKET 18POS TIN 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,392
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
AR 18 HZL-TT
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2,622
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Assmann WSW Components CONN IC DIP SOCKET 18POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
110-44-318-41-001000
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940
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS TIN 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy