Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,571
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Samtec Inc. CONN IC DIP SOCKET 16POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Brass
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1,514
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Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper - Brass
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3,801
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Samtec Inc. CONN IC DIP SOCKET 16POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 16 (2 x 8) Beryllium Copper - Brass
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1,558
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Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICA Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper - Brass
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2,782
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Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper - Brass
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2,296
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Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper - Brass
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1,049
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Samtec Inc. CONN IC DIP SOCKET 8POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper - Brass
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2,345
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Assmann WSW Components CONN IC DIP SOCKET 4POS TIN - Active Bulk -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - 4 (2 x 2) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,198
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Samtec Inc. CONN IC DIP SOCKET 14POS TIN ICO Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - 14 (2 x 7) Beryllium Copper - Brass