Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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986
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Obsolete Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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2,046
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,137
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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2,388
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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694
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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2,489
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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3,444
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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1,862
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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2,571
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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3,333
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,286
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,898
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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930
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
14-820-90
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3,105
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
14-810-90C
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3,229
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
14-823-90
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3,584
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,299
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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982
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
14-810-90
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1,987
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze