Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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08-6810-90C
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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2,366
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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3,069
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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1,421
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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731
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,553
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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1,035
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
08-6820-90C
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1,827
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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2,107
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
08-6810-90
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2,343
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,403
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,803
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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3,737
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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3,858
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
08-823-90
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636
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,229
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,755
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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3,309
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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1,646
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,103
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,365
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,308
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,991
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
08-810-90
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3,246
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze