- Operating Temperature :
- Mounting Type :
- Termination :
- Type :
- Housing Material :
-
- Polyamide (PA), Nylon, Glass Filled (4)
- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (6)
- Polybutylene Terephthalate (PBT), Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (3)
- Polysulfone (PSU), Glass Filled (1)
- Thermoplastic (1)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
23 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,686
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,225
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,201
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,428
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,635
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,676
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,620
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,859
In-stock
|
Harwin Inc. | CONN SOCKET SIP 10POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (1 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,203
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | 500 | Active | Bulk | - | Through Hole | Solder | - | SIP | Thermoplastic | 0.100" (2.54mm) | Gold | - | Gold | 10 (1 x 10) | Beryllium Copper | - | Beryllium Copper | |||
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|
VIEW |
2,633
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 10POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,428
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,597
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0517 | Active | Bulk | - | Through Hole, Right Angle | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,265
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,690
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,120
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,790
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,959
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 10POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,371
In-stock
|
Harwin Inc. | CONN SOCKET SIP 10POS GOLD | D01-995 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (1 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,947
In-stock
|
Aries Electronics | CONN SOCKET SIP 10POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,487
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 10POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (1 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,548
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 10POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,914
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 10POS GOLD | 310 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,164
In-stock
|
3M | CONN SOCKET SIP ZIF 10POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (1 x 10) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
