- Series :
- Part Status :
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12 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
1,711
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,956
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | Gold | 18 (2 x 9) | - | - | - | |||
|
VIEW |
3,260
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Gold | 18 (2 x 9) | - | - | - | |||
|
VIEW |
3,287
In-stock
|
3M | CONN SOCKET SOIC 18POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | Gold | 18 (2 x 9) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,326
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | 18 (2 x 9) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,272
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 500 | Obsolete | - | - | Through Hole | - | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | 18 (2 x 9) | - | - | - | |||
|
|
VIEW |
2,519
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,315
In-stock
|
CNC Tech | CONN IC DIP SOCKET 18POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,530
In-stock
|
CNC Tech | CONN IC DIP SOCKET 18POS GOLD | - | Active | Tube | -40°C ~ 105°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,373
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 800 | Active | Bulk | - | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Tin-Lead | 18 (2 x 9) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
3,531
In-stock
|
CNC Tech | CONN IC DIP SOCKET 18POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,969
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
