Contact Finish - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,060
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Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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3,435
In-stock
Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
AR08-HZW/T
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2,399
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
A08-LCG
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2,761
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete - - Through Hole - Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 8 (2 x 4) - - -
2-640463-4
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3,557
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 8 (2 x 4) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
C9108-00
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938
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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802
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 8 (2 x 4) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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3,394
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.3" (7.62mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 8 (2 x 4) Beryllium Copper 20.0µin (0.51µm) Beryllium Copper
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3,718
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 800 Obsolete - - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 8 (2 x 4) Copper Alloy - -
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2,676
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 800 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 8 (2 x 4) Copper Alloy - Brass
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1,512
In-stock
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 8 (2 x 4) Beryllium Copper Flash Brass
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1,154
In-stock
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 8 (2 x 4) Beryllium Copper Flash Brass
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VIEW
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2,168
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 800 Obsolete - - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 8 (2 x 4) Copper Alloy - -
1825373-2
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1,519
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 8 (2 x 4) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
1-1825093-2
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1,287
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 (2 x 4) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
A08-LCG-T-R
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2,618
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 8 (2 x 4) - - -
1825093-2
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1,155
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 8 (2 x 4) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
AR08-HZL/07-TT
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RFQ
3,175
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZL/01-TT
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3,703
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-640463-2
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RFQ
1,539
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 (2 x 4) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641260-4
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2,560
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 (2 x 4) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
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3,111
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper - Brass
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774
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete - - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper - Brass
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RFQ
1,157
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 8 (2 x 4) Beryllium Copper 25.0µin (0.63µm) Nickel
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RFQ
1,950
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash - 8 (2 x 4) Beryllium Copper - Bronze
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1,114
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Obsolete Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Gold 8 (2 x 4) Beryllium Copper 5.00µin (0.127µm) Brass
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RFQ
874
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Obsolete Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper Flash Brass
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RFQ
1,877
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Obsolete Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 8 (2 x 4) Beryllium Copper 30.0µin (0.76µm) Brass
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RFQ
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RFQ
1,956
In-stock
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Closed Frame, Seal Tape DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 8 (2 x 4) Beryllium Copper Flash Brass
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RFQ
2,323
In-stock
3M CONN IC DIP SOCKET 8POS GOLD 100 Obsolete Bulk -65°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 8 (2 x 4) Beryllium Copper Flash Brass