- Contact Material - Mating :
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6 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
3,557
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | |||
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|
VIEW |
1,519
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | |||
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|
VIEW |
1,287
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 30.0µin (0.76µm) | |||
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|
VIEW |
1,155
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | |||
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|
VIEW |
1,539
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 30.0µin (0.76µm) | |||
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|
VIEW |
2,560
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Phosphor Bronze | 15.0µin (0.38µm) | |||
