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11 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,927
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (1 x 32) | Beryllium Copper | Brass | |||
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2,824
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | Brass | |||
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3,459
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (1 x 20) | Beryllium Copper | Brass | |||
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1,961
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | Brass | |||
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VIEW |
2,355
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 24 (2 x 12) | Beryllium Copper | Brass | |||
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VIEW |
1,551
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | 24 (2 x 12) | Beryllium Copper | Brass | |||
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VIEW |
2,814
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 22POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | 22 (2 x 11) | Beryllium Copper | Brass | |||
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VIEW |
2,873
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 26POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 26 (1 x 26) | Beryllium Copper | Brass | |||
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VIEW |
3,959
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 10POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 10 (1 x 10) | Beryllium Copper | Brass | |||
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VIEW |
3,856
In-stock
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Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 8POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | Brass | |||
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VIEW |
1,487
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 10POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 10 (1 x 10) | Beryllium Copper | Brass | |||
