- Series :
- Part Status :
- Termination :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (8)
- 12 (2 x 6) (4)
- 14 (2 x 7) (5)
- 16 (2 x 8) (5)
- 18 (2 x 9) (4)
- 20 (2 x 10) (7)
- 20 (4 x 5) (3)
- 22 (2 x 11) (6)
- 24 (2 x 12) (4)
- 26 (2 x 13) (2)
- 28 (2 x 14) (4)
- 28 (4 x 7) (2)
- 30 (2 x 15) (6)
- 32 (2 x 16) (6)
- 32 (2 x 7, 2 x 9) (2)
- 32 (4 x 8) (1)
- 34 (2 x 17) (2)
- 36 (2 x 18) (4)
- 38 (2 x 19) (2)
- 40 (2 x 20) (6)
- 44 (4 x 11) (2)
- 48 (2 x 24) (2)
- 50 (2 x 25) (2)
- 52 (4 x 13) (2)
- 6 (2 x 3) (6)
- 60 (2 x 30) (2)
- 64 (2 x 32) (2)
- 68 (4 x 17) (3)
- 8 (2 x 4) (6)
- 84 (4 x 21) (2)
- Contact Material - Mating :
- Applied Filters :
112 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
3,162
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 16 (2 x 8) | Phosphor Bronze | 15.0µin (0.38µm) | |||
|
VIEW |
1,599
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 15.0µin (0.38µm) | |||
|
VIEW |
2,272
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 84POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 84 (4 x 21) | Phosphor Bronze | - | |||
|
VIEW |
1,258
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 68POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 68 (4 x 17) | Phosphor Bronze | - | |||
|
VIEW |
2,069
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 32POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 32 (2 x 7, 2 x 9) | Phosphor Bronze | - | |||
|
VIEW |
1,570
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 28POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 28 (4 x 7) | Phosphor Bronze | - | |||
|
VIEW |
750
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 20POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 20 (4 x 5) | Phosphor Bronze | - | |||
|
|
VIEW |
3,198
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 68POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 68 (4 x 17) | Phosphor Bronze | - | |||
|
VIEW |
3,043
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 52POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 52 (4 x 13) | Phosphor Bronze | - | |||
|
VIEW |
3,308
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 44POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 44 (4 x 11) | Phosphor Bronze | - | |||
|
|
VIEW |
1,545
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 32POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 32 (2 x 7, 2 x 9) | Phosphor Bronze | - | |||
|
|
VIEW |
1,950
In-stock
|
Assmann WSW Components | CONN SOCKET PLCC 20POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 20 (4 x 5) | Phosphor Bronze | - | |||
|
VIEW |
863
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Phosphor Bronze | - | |||
|
VIEW |
1,267
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
3,004
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
1,249
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
1,735
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | |||
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|
VIEW |
2,976
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | |||
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|
VIEW |
3,442
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
3,981
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
2,023
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 50 (2 x 25) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
2,622
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
3,470
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
648
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
820
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
2,479
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
3,036
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
1,064
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
1,337
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
|
VIEW |
1,626
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | |||
