Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,828
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
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RFQ
1,269
In-stock
Harwin Inc. CONNECTOR D01-993 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass - Brass
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RFQ
VIEW
RFQ
645
In-stock
Amphenol FCI CONN SOCKET SIP 2POS TIN - Obsolete Tape & Reel (TR) - Surface Mount Solder Closed Frame SIP Polyamide (PA), Nylon 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-382719-1
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RFQ
3,215
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 30POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 30 (2 x 15) Beryllium Copper - Beryllium Copper
2-382714-1
RFQ
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RFQ
2,279
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Beryllium Copper
2-382712-1
RFQ
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RFQ
3,477
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper - Beryllium Copper
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RFQ
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RFQ
1,455
In-stock
Assmann WSW Components CONN IC DIP SOCKET 32POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
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RFQ
2,924
In-stock
CNC Tech CONN IC DIP SOCKET 48POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 48 (2 x 24) Phosphor Bronze 100.0µin (2.54µm) Phosphor Bronze
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RFQ
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RFQ
3,598
In-stock
CNC Tech CONN IC DIP SOCKET 6POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin 60.0µin (1.52µm) Tin 6 (2 x 3) Phosphor Bronze 60.0µin (1.52µm) Phosphor Bronze
1-390262-3
RFQ
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RFQ
1,026
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Cut Tape (CT) -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
1-390262-3
RFQ
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RFQ
2,320
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Obsolete Tape & Reel (TR) -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Phosphor Bronze - Phosphor Bronze
10-18-2031
RFQ
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RFQ
3,670
In-stock
Molex, LLC CONN SOCKET TRANSIST TO-220 3POS 4038 Obsolete - - Through Hole Solder Closed Frame Transistor, TO-220 Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 3 (Rectangular) Brass 100.0µin (2.54µm) Brass
AR64-HZL-TT
RFQ
VIEW
RFQ
1,557
In-stock
Assmann WSW Components CONN IC DIP SOCKET 64POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR48-HZL-TT
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VIEW
RFQ
993
In-stock
Assmann WSW Components CONN IC DIP SOCKET 48POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZL-TT
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VIEW
RFQ
3,203
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZL-TT
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VIEW
RFQ
2,541
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZL-TT
RFQ
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RFQ
2,967
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
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RFQ
1,531
In-stock
Assmann WSW Components CONN IC DIP SOCKET 22POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR20-HZL-TT
RFQ
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RFQ
2,153
In-stock
Assmann WSW Components CONN IC DIP SOCKET 20POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR18-HZL-TT
RFQ
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RFQ
3,872
In-stock
Assmann WSW Components CONN IC DIP SOCKET 18POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR16-HZL-TT
RFQ
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RFQ
3,557
In-stock
Assmann WSW Components CONN IC DIP SOCKET 16POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR14-HZL-TT
RFQ
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RFQ
1,947
In-stock
Assmann WSW Components CONN IC DIP SOCKET 14POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZL-TT
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RFQ
3,115
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
28-516-10
RFQ
VIEW
RFQ
2,644
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
24-516-10
RFQ
VIEW
RFQ
1,927
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
RFQ
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RFQ
3,434
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
C8140-04
RFQ
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RFQ
2,107
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (2 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8128-04
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RFQ
1,099
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8124-04
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RFQ
3,376
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
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RFQ
2,250
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (2 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze