- Part Status :
- Termination :
- Housing Material :
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- Polyamide (PA), Nylon (1)
- Polyamide (PA46), Nylon 4/6 (2)
- Polyamide (PA46), Nylon 4/6, Glass Filled (64)
- Polybutylene Terephthalate (PBT) (2)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (7)
- Polyester (8)
- Polyether Imide (PEI), Glass Filled (1)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (5)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
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95 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
2,279
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
806
In-stock
|
3M | CONN IC DIP SOCKET ZIF 20POS GLD | OEM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Gold | 20 (2 x 10) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | ||||
VIEW |
1,887
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
1,869
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 20 (2 x 10) | Copper Alloy | - | - | ||||
VIEW |
1,659
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
1,807
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin | - | - | 20 (2 x 10) | Copper Alloy | - | - | ||||
VIEW |
649
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 20 (2 x 10) | - | - | - | ||||
VIEW |
2,582
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
863
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,759
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
3,988
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,047
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Copper | ||||
VIEW |
3,926
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 20 (2 x 10) | Beryllium Copper | 25.0µin (0.63µm) | Copper | ||||
VIEW |
2,265
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Copper | ||||
VIEW |
2,519
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,066
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,573
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 20 (2 x 10) | Copper Alloy | - | - | ||||
VIEW |
1,078
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
3,011
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,684
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,477
In-stock
|
Aries Electronics | CONN SOCKET SIP 20POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (2 x 10) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
1,030
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,272
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,337
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TINLEAD | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 20 (2 x 10) | Beryllium Copper | - | Brass | ||||
VIEW |
1,404
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Nickel | ||||
VIEW |
1,288
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,288
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,088
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
3,701
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass | ||||
VIEW |
1,320
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass |