Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,269
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Harwin Inc. CONNECTOR D01-993 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Cup - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin - Tin 32 (1 x 32) Brass - Brass
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3,835
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,452
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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2,641
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, C93 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
28-516-10
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RFQ
2,644
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
24-516-10
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RFQ
1,927
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
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RFQ
3,434
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
C9140-00
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RFQ
2,658
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (2 x 20) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9128-00
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RFQ
1,237
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9124-00
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RFQ
800
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 24 (2 x 12) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9122-00
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RFQ
3,974
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (2 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9120-00
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RFQ
3,167
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (2 x 10) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9118-00
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RFQ
2,246
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (2 x 9) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9116-00
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RFQ
1,145
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (2 x 8) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9114-00
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RFQ
1,946
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C9108-00
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VIEW
RFQ
938
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD Edge-Grip™, C91 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
C8140-04
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RFQ
2,107
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (2 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8128-04
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RFQ
1,099
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8124-04
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RFQ
3,376
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
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RFQ
2,250
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (2 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8120-04
RFQ
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RFQ
1,887
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 20 (2 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8118-04
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RFQ
1,624
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8116-04
RFQ
VIEW
RFQ
3,753
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8114-04
RFQ
VIEW
RFQ
3,538
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8108-04
RFQ
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RFQ
3,601
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 8 (2 x 4) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
986
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Obsolete Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
861
In-stock
Aries Electronics CONN SOCKET SIP 6POS GOLD 0513 Obsolete Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,818
In-stock
Aries Electronics CONN IC DIP SOCKET 60POS GOLD 518 Obsolete Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 60 (2 x 30) Beryllium Copper 200.0µin (5.08µm) Brass