Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
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RFQ
3,309
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
10-2810-90C
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RFQ
3,709
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Vertical Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass