- Series :
- Part Status :
- Operating Temperature :
- Mounting Type :
- Termination :
- Features :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (1)
- 10 (2 x 5) (4)
- 1155 (40 x 40) (1)
- 1356 (32 x 41) (1)
- 1366 (32 x 41) (2)
- 14 (2 x 7) (2)
- 1567 (1)
- 16 (2 x 8) (2)
- 18 (2 x 9) (2)
- 20 (2 x 10) (5)
- 2011 (47 x 58) (5)
- 22 (2 x 11) (4)
- 24 (2 x 12) (8)
- 28 (2 x 14) (6)
- 32 (2 x 16) (6)
- 321 (19 x 19) (4)
- 36 (2 x 18) (2)
- 3647 (6)
- 370 (19 x 19) (1)
- 4 (2 x 2) (2)
- 40 (2 x 20) (3)
- 42 (2 x 21) (2)
- 478 (26 x 26) (1)
- 479 (26 x 26) (3)
- 48 (2 x 24) (2)
- 50 (2 x 25) (4)
- 52 (2 x 26) (4)
- 6 (2 x 3) (2)
- 64 (2 x 32) (2)
- 771 (33 x 33) (1)
- 8 (2 x 4) (2)
- Contact Material - Mating :
- Pitch - Post :
- Contact Material - Post :
- Applied Filters :
91 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
|
VIEW |
2,539
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
VIEW |
658
In-stock
|
Molex, LLC | CONN SOCKET LGA 1155POS GOLD | 47596 | Obsolete | Tray | - | Surface Mount | Solder | Open Frame | LGA | Thermoplastic | 0.036" (0.91mm) | Gold | 30.0µin (0.76µm) | - | 1155 (40 x 40) | Copper Alloy | 0.036" (0.91mm) | - | - | |||
|
|
VIEW |
1,989
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,735
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 321POS GOLD | - | Obsolete | Tray | - | Through Hole | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 321 (19 x 19) | Copper Alloy | 0.100" (2.54mm) | 30.0µin (0.76µm) | Copper Alloy | |||
|
|
VIEW |
1,361
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,592
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
966
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,397
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
815
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET LGA 1567POS GOLD | - | Active | Tray | - | Surface Mount | Solder | Open Frame | LGA | Thermoplastic | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | - | 1567 | Copper Alloy | 0.039" (1.00mm) | - | Copper Alloy | |||
|
|
VIEW |
2,248
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
2,502
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 52 (2 x 26) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,630
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 52POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 52 (2 x 26) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
3,734
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 50POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 50 (2 x 25) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,369
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,795
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
2,990
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
3,572
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
3,995
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 42POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
2,679
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET LGA 771POS GOLD | - | Obsolete | Tray | -25°C ~ 100°C | Surface Mount | Solder | Open Frame | LGA | Thermoplastic | 0.043" (1.09mm) | Gold | 30.0µin (0.76µm) | - | 771 (33 x 33) | Copper Alloy | 0.043" (1.09mm) | - | - | |||
|
|
VIEW |
1,635
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 321POS GOLD | - | Obsolete | Tray | - | Through Hole | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 321 (19 x 19) | Copper Alloy | 0.100" (2.54mm) | 30.0µin (0.76µm) | Copper Alloy | |||
|
|
VIEW |
1,872
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 321POS GOLD | - | Obsolete | Tray | - | Through Hole | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 321 (19 x 19) | Copper Alloy | 0.100" (2.54mm) | 30.0µin (0.76µm) | Copper Alloy | |||
|
|
VIEW |
3,419
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 478POS GOLD | - | Obsolete | - | - | Surface Mount | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Gold | 478 (26 x 26) | Copper Alloy | 0.050" (1.27mm) | 30.0µin (0.76µm) | Copper Alloy | |||
|
|
VIEW |
3,204
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 321POS GOLD | - | Obsolete | Tray | - | Through Hole | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 321 (19 x 19) | Copper Alloy | 0.100" (2.54mm) | 30.0µin (0.76µm) | Copper Alloy | |||
|
|
VIEW |
1,778
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 370POS GOLD | - | Obsolete | Tray | - | Through Hole | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 370 (19 x 19) | Phosphor Bronze | 0.100" (2.54mm) | 30.0µin (0.76µm) | Phosphor Bronze | |||
|
VIEW |
2,284
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 479POS GOLD | - | Obsolete | Digi-Reel® | - | Surface Mount | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Gold | 479 (26 x 26) | Copper Alloy | 0.050" (1.27mm) | 30.0µin (0.76µm) | Copper Alloy | |||
|
|
VIEW |
2,379
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 479POS GOLD | - | Obsolete | Cut Tape (CT) | - | Surface Mount | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Gold | 479 (26 x 26) | Copper Alloy | 0.050" (1.27mm) | 30.0µin (0.76µm) | Copper Alloy | |||
|
|
VIEW |
738
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA ZIF 479POS GOLD | - | Obsolete | Tape & Reel (TR) | - | Surface Mount | Solder | Open Frame | PGA, ZIF (ZIP) | Thermoplastic | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | Gold | 479 (26 x 26) | Copper Alloy | 0.050" (1.27mm) | 30.0µin (0.76µm) | Copper Alloy | |||
|
VIEW |
3,519
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,839
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,992
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 28POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy | |||
