Contact Finish - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,842
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TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 0.039" (1.00mm) 15.0µin (0.38µm) Copper Alloy
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3,858
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 989POS GOLD - Obsolete Bulk - Surface Mount Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.039" (1.00mm) Gold 15.0µin (0.38µm) Tin-Lead 989 (35 x 36) Copper Alloy 0.039" (1.00mm) 15.0µin (0.38µm) Copper Alloy
2134146-3
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RFQ
3,101
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Cut Tape (CT) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy 0.157" (4.00mm) Flash Copper Alloy
2134146-3
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RFQ
2,098
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Tape & Reel (TR) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy 0.157" (4.00mm) Flash Copper Alloy
2134146-2
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RFQ
2,352
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Cut Tape (CT) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy 0.157" (4.00mm) Flash Copper Alloy
2134146-2
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RFQ
2,621
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 989POS GOLD - Obsolete Tape & Reel (TR) - Surface Mount Solder Open Frame PGA Thermoplastic 0.157" (4.00mm) Gold Flash Tin-Lead 989 (35 x 36) Copper Alloy 0.157" (4.00mm) Flash Copper Alloy
2040636-1
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RFQ
3,162
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1567POS GOLD - Obsolete Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 15.0µin (0.38µm) - 1567 Copper Alloy 0.039" (1.00mm) - Copper Alloy
2-382468-4
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RFQ
2,801
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Tin-Lead 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) - Phosphor Bronze
2-382189-2
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RFQ
2,539
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
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658
In-stock
Molex, LLC CONN SOCKET LGA 1155POS GOLD 47596 Obsolete Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 30.0µin (0.76µm) - 1155 (40 x 40) Copper Alloy 0.036" (0.91mm) - -
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RFQ
3,527
In-stock
Molex, LLC CONN SOCKET LGA 1155POS GOLD 47596 Obsolete Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) - 1155 (40 x 40) Copper Alloy 0.036" (0.91mm) - -
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RFQ
VIEW
RFQ
1,801
In-stock
Molex, LLC CONN SOCKET LGA 1156POS GOLD 47596 Obsolete Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) - 1156 (40 x 40) Copper Alloy 0.036" (0.91mm) - -
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RFQ
2,676
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 800 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 8 (2 x 4) Copper Alloy 0.100" (2.54mm) - Brass
5916716-1
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RFQ
3,735
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA ZIF 321POS GOLD - Obsolete Tray - Through Hole Solder Open Frame PGA, ZIF (ZIP) Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 321 (19 x 19) Copper Alloy 0.100" (2.54mm) 30.0µin (0.76µm) Copper Alloy
2-641932-2
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RFQ
2,592
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
2-644018-4
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RFQ
2,592
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 32 (2 x 16) Phosphor Bronze 0.100" (2.54mm) 15.0µin (0.38µm) Phosphor Bronze
2-641933-1
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RFQ
2,022
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - Tin 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
2-641932-4
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RFQ
1,719
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) 15.0µin (0.38µm) Phosphor Bronze
2-644018-2
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RFQ
966
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
2-382189-1
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RFQ
3,389
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN Diplomate DL Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
2-641616-2
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RFQ
3,397
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
2-382470-3
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RFQ
849
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - Tin-Lead 32 (2 x 16) Phosphor Bronze 0.100" (2.54mm) - Phosphor Bronze
2-382467-3
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RFQ
3,149
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) - Phosphor Bronze
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RFQ
815
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1567POS GOLD - Active Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 30.0µin (0.76µm) - 1567 Copper Alloy 0.039" (1.00mm) - Copper Alloy
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RFQ
2,248
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
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RFQ
1,993
In-stock
Molex, LLC CONN SOCKET LGA 2011POS GOLD 105142 Active Bulk - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 15.0µin (0.38µm) - 2011 (47 x 58) Copper Alloy 0.040" (1.01mm) - Copper Alloy
1051420132
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RFQ
3,745
In-stock
Molex, LLC CONN SOCKET LGA 2011POS GOLD 105142 Active Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 15.0µin (0.38µm) - 2011 (47 x 58) Copper Alloy 0.040" (1.01mm) - -
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RFQ
2,502
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
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RFQ
1,630
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
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RFQ
3,734
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy