Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,044
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Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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3,236
In-stock
Harwin Inc. CONN IC DIP SOCKET 22POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (2 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
876
In-stock
Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
2,860
In-stock
Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,176
In-stock
Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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2,187
In-stock
Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,435
In-stock
Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,550
In-stock
Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,452
In-stock
Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D0 Obsolete Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
AR40-HZW/T
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3,115
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR28-HZW/T
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RFQ
2,987
In-stock
Assmann WSW Components CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR24-HZW/T
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3,093
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
2,577
In-stock
Assmann WSW Components CONN IC DIP SOCKET 22POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR20-HZW/T
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996
In-stock
Assmann WSW Components CONN IC DIP SOCKET 20POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR18-HZW/T
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1,711
In-stock
Assmann WSW Components CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR16-HZW/T
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3,658
In-stock
Assmann WSW Components CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZW/T
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2,399
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
3,651
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 132POS GOLD 522 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 132 (14 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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RFQ
2,189
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
741
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 10.0µin (0.25µm) Brass
AR64-HZW/T-R
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668
In-stock
Assmann WSW Components CONN IC DIP SOCKET 64POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
VIEW
RFQ
1,716
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PGA 68POS GOLD 522 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (11 x 11) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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VIEW
RFQ
721
In-stock
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
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RFQ
3,531
In-stock
Aries Electronics CONN IC DIP SOCKET 50POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,403
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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RFQ
VIEW
RFQ
2,117
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,516
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
995
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,211
In-stock
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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VIEW
RFQ
632
In-stock
Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 10.0µin (0.25µm) Brass