Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,267
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3M CONN ZIG-ZAG 39POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Zig-Zag Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 39 (1 x 19, 1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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2,639
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3M CONN ZIG-ZAG 39POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Zig-Zag Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 39 (1 x 19, 1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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2,775
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Aries Electronics CONN SOCKET PGA ZIF GOLD - Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,176
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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1,049
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS GOLD - Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 10 (2 x 5) Beryllium Copper - Brass
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2,251
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (1 x 10) Beryllium Copper 30.0µin (0.76µm) Brass
0804MC
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657
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Texas Instruments CONN TRANSIST TO-3 8POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Gold 30.0µin (0.76µm) Tin 8 (Oval) Beryllium Copper 200.0µin (5.08µm) Brass