- Operating Temperature :
- Termination :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
13 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,531
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,577
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,441
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 22 (2 x 11) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,364
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 22 (2 x 11) | - | - | - | |||
|
VIEW |
2,145
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Obsolete | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | Tin | 22 (2 x 11) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
727
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 123 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,264
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 123 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,512
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 122 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
1,083
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 110 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Decoupling Capacitor | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,782
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 110 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame, Decoupling Capacitor | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,116
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 22 (2 x 11) | Beryllium Copper | 25.0µin (0.63µm) | Copper | |||
|
|
VIEW |
2,466
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 22 (2 x 11) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
|
|
VIEW |
2,686
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
