Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,886
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Samtec Inc. CONN IC DIP SOCKET 28POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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3,837
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Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
6-1437535-3
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1,771
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TE Connectivity AMP Connectors CONN SOCKET SIP 8POS GOLD 500 Obsolete Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (1 x 8) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,250
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TE Connectivity AMP Connectors CONN SOCKET PGA 68POS GOLD - Obsolete Bulk - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 68 (11 x 11) Beryllium Copper 10.0µin (0.25µm) Brass