- Manufacture :
- Operating Temperature :
- Mounting Type :
- Termination :
- Contact Finish Thickness - Mating :
- Contact Finish Thickness - Post :
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11 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
1,547
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
1,044
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
3,452
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
2,180
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||||
VIEW |
2,373
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||||
VIEW |
2,054
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||||
VIEW |
1,985
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||||
VIEW |
839
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 24POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 24 (2 x 12) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | ||||
VIEW |
3,880
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||||
VIEW |
2,450
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass | ||||
VIEW |
1,098
In-stock
|
3M | CONN IC DIP SOCKET 24POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 24 (2 x 12) | Beryllium Copper | Flash | Brass |