Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,149
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Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 20 (1 x 20) Beryllium Copper - Brass
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3,966
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Amphenol FCI CONN SOCKET SIP 20POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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3,583
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Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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673
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Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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2,304
In-stock
Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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2,459
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Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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1,468
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Assmann WSW Components CONN SOCKET SIP 20POS TIN - Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Tin 78.7µin (2.00µm) 20 (1 x 20) - - -
643652-6
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2,629
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 20 (1 x 20) Beryllium Copper - Beryllium Copper
643652-3
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3,001
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 20 (1 x 20) Phosphor Bronze - Phosphor Bronze
643652-1
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2,760
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 20 (1 x 20) Beryllium Copper - Beryllium Copper
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3,261
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Omron Electronics Inc-EMC Div CONN IC SOCKET 20POS XR2 Obsolete Bulk -55°C ~ 125°C - Solder Closed Frame Housing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) - - 20 (1 x 20) Beryllium Copper - Beryllium Copper
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1,980
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) 20 (1 x 20) Beryllium Copper 29.5µin (0.75µm) Brass
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2,201
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - 20 (1 x 20) Beryllium Copper - Beryllium Copper