- Operating Temperature :
- Mounting Type :
- Termination :
- Housing Material :
-
- Aluminum Alloy (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (1)
- Polybutylene Terephthalate (PBT), Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (2)
- Polyphenylene Sulfide (PPS), Glass Filled (4)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (7)
- Thermoplastic, Polyester (3)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Applied Filters :
26 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,801
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Tin-Lead | 40 (2 x 20) | Phosphor Bronze | - | Phosphor Bronze | |||
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VIEW |
3,115
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,037
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 40 (2 x 20) | - | - | - | |||
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VIEW |
1,057
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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VIEW |
2,658
In-stock
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Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,242
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,500
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,463
In-stock
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3M | CONN IC DIP SOCKET 40POS GOLD | 400 | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | - | 8.00µin (0.203µm) | - | |||
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VIEW |
2,096
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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VIEW |
2,839
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | 700 | Obsolete | - | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Aluminum Alloy | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 40 (2 x 20) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
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VIEW |
2,933
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
2,994
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
3,809
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,689
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 40 (2 x 20) | - | - | - | |||
|
VIEW |
1,835
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,595
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,902
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,397
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
1,190
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,499
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
2,864
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC DIP SOCKET 40POS GOLD | XR2 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 40 (2 x 20) | Beryllium Copper | 29.5µin (0.75µm) | Beryllium Copper | |||
|
VIEW |
3,445
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
690
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | 800 | Obsolete | Tube | - | Surface Mount | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 40 (2 x 20) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,297
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 400 | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | - | 8.00µin (0.203µm) | - | |||
|
VIEW |
785
In-stock
|
3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame, Seal Tape | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
2,023
In-stock
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3M | CONN IC DIP SOCKET 40POS GOLD | 100 | Obsolete | Bulk | -65°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Gold | 40 (2 x 20) | Beryllium Copper | Flash | Brass |