Contact Finish - Mating :
Contact Material - Mating :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post
GLOBAL STOCKS
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RFQ
1,925
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Silver 50.0µin (1.27µm) 3 (Oval) Beryllium Copper - Beryllium Copper
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RFQ
VIEW
RFQ
1,830
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Phenolic - Silver 500.0µin (12.70µm) 3 (Oval) Beryllium Copper - Beryllium Copper
2040636-1
RFQ
VIEW
RFQ
3,162
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1567POS GOLD - Obsolete Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 15.0µin (0.38µm) 1567 Copper Alloy 0.039" (1.00mm) Copper Alloy
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RFQ
VIEW
RFQ
3,685
In-stock
Molex, LLC CONN SOCKET LGA 1155POS 47596 Obsolete - - - - - LGA - - - - - - - -
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RFQ
VIEW
RFQ
1,883
In-stock
Molex, LLC CONN SOCKET LGA 1156POS GOLD 47596 Obsolete Tray - Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1156 (40 x 40) Copper Alloy 0.036" (0.91mm) -
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RFQ
VIEW
RFQ
701
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1944POS GOLD - Obsolete Tray - Surface Mount Solder Open Frame LGA Liquid Crystal Polymer (LCP) 0.039" (1.00mm) Gold 30.0µin (0.76µm) 1944 (G34) Copper Alloy 0.039" (1.00mm) -
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RFQ
VIEW
RFQ
658
In-stock
Molex, LLC CONN SOCKET LGA 1155POS GOLD 47596 Obsolete Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 30.0µin (0.76µm) 1155 (40 x 40) Copper Alloy 0.036" (0.91mm) -
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RFQ
VIEW
RFQ
3,527
In-stock
Molex, LLC CONN SOCKET LGA 1155POS GOLD 47596 Obsolete Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1155 (40 x 40) Copper Alloy 0.036" (0.91mm) -
Default Photo
RFQ
VIEW
RFQ
1,801
In-stock
Molex, LLC CONN SOCKET LGA 1156POS GOLD 47596 Obsolete Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) 1156 (40 x 40) Copper Alloy 0.036" (0.91mm) -
0475943001
RFQ
VIEW
RFQ
1,265
In-stock
Molex, LLC CONN SOCKET LGA 1356POS GOLD 47594 Obsolete Tray - Surface Mount - Open Frame LGA - 0.040" (1.02mm) Gold 15.0µin (0.38µm) 1356 (32 x 41) - - -
0475940002
RFQ
VIEW
RFQ
2,204
In-stock
Molex, LLC CONN SOCKET LGA 1366POS GOLD 47594 Obsolete Tray - Surface Mount Solder Open Frame LGA Liquid Crystal Polymer (LCP) 0.040" (1.02mm) Gold 30.0µin (0.76µm) 1366 (32 x 41) Copper Alloy 0.040" (1.01mm) -
0475940001
RFQ
VIEW
RFQ
3,545
In-stock
Molex, LLC CONN SOCKET LGA 1366POS GOLD 47594 Obsolete Tray - Surface Mount Solder Open Frame LGA Liquid Crystal Polymer (LCP) 0.040" (1.02mm) Gold 15.0µin (0.38µm) 1366 (32 x 41) Copper Alloy 0.040" (1.01mm) -
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RFQ
VIEW
RFQ
1,137
In-stock
TE Connectivity Potter & Brumfield Relays CONN IC DIP SOCKET 32POS TINLEAD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) 32 (2 x 16) Copper Alloy 0.100" (2.54mm) -
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RFQ
VIEW
RFQ
3,919
In-stock
Aries Electronics COLLET PIN CARRIER 20-PIN .300 - Obsolete - - - - - - - - - - - - - -
32-536-11
RFQ
VIEW
RFQ
907
In-stock
Aries Electronics CONN SOCKET PLCC ZIF 32POS GOLD 536 Obsolete - - Through Hole - Open Frame PLCC, ZIF (ZIP) - 0.050" (1.27mm) Gold 12.0µin (0.30µm) 32 (2 x 7, 2 x 9) - - -
52-536-11
RFQ
VIEW
RFQ
3,162
In-stock
Aries Electronics CONN SOCKET PLCC ZIF 52POS GOLD 536 Obsolete - - Through Hole - Open Frame PLCC, ZIF (ZIP) - 0.050" (1.27mm) Gold 12.0µin (0.30µm) 52 (4 x 13) - - -
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RFQ
VIEW
RFQ
3,634
In-stock
Molex, LLC CONN IC DIP SOCKET 28POS TINLEAD - Obsolete - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 28 (2 x 14) - - -
84-536-11
RFQ
VIEW
RFQ
2,256
In-stock
Aries Electronics CONN SOCKET PLCC ZIF 84POS GOLD 536 Obsolete - - Through Hole - Open Frame PLCC, ZIF (ZIP) - 0.050" (1.27mm) Gold 12.0µin (0.30µm) 84 (4 x 21) - - -
68-536-11
RFQ
VIEW
RFQ
2,679
In-stock
Aries Electronics CONN SOCKET PLCC ZIF 68POS GOLD 536 Obsolete - - Through Hole - Open Frame PLCC, ZIF (ZIP) - 0.050" (1.27mm) Gold 12.0µin (0.30µm) 68 (4 x 17) - - -
44-536-11
RFQ
VIEW
RFQ
1,247
In-stock
Aries Electronics CONN SOCKET PLCC ZIF 44POS GOLD 536 Obsolete - - Through Hole - Open Frame PLCC, ZIF (ZIP) - 0.050" (1.27mm) Gold 12.0µin (0.30µm) 44 (4 x 11) - - -
28-536-11
RFQ
VIEW
RFQ
986
In-stock
Aries Electronics CONN SOCKET PLCC ZIF 28POS GOLD 536 Obsolete - - Through Hole - Open Frame PLCC, ZIF (ZIP) - 0.050" (1.27mm) Gold 12.0µin (0.30µm) 28 (4 x 7) - - -
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RFQ
VIEW
RFQ
1,556
In-stock
Amphenol FCI CONN SOCKET SIP 10POS TIN-LEAD SPF080-1x Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 10 (1 x 10) - - -
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RFQ
VIEW
RFQ
3,386
In-stock
Amphenol FCI CONN SOCKET SIP 8POS TIN-LEAD SPF080-1x Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 8 (1 x 8) - - -
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RFQ
VIEW
RFQ
3,393
In-stock
Amphenol FCI CONN SOCKET SIP 4POS TIN-LEAD SPF080-1x Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 4 (1 x 4) - - -
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RFQ
VIEW
RFQ
1,036
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 14 (2 x 7) Copper Alloy 0.100" (2.54mm) -
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RFQ
VIEW
RFQ
1,869
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 20 (2 x 10) Copper Alloy 0.100" (2.54mm) -
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RFQ
VIEW
RFQ
3,703
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass
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RFQ
VIEW
RFQ
3,575
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 16 (2 x 8) Copper Alloy 0.100" (2.54mm) -
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RFQ
VIEW
RFQ
1,256
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 64POS TIN 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyester 0.100" (2.54mm) Tin - 64 (2 x 32) Copper Alloy 0.100" (2.54mm) -
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RFQ
VIEW
RFQ
1,700
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 28 (2 x 14) Copper Alloy 0.100" (2.54mm) -