- Packaging :
- Termination :
- Housing Material :
-
- Aluminum Alloy (11)
- Diallyl Phthalate (DAP) (10)
- Liquid Crystal Polymer (LCP) (3)
- Phenolic (6)
- Polyamide (PA), Nylon (3)
- Polyamide (PA), Nylon, Glass Filled (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (11)
- Polybutylene Terephthalate (PBT), Glass Filled (6)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (32)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (25)
- Polyester (3)
- Polyester, Glass Filled (3)
- Polyphenylene Sulfide (PPS) (11)
- Polyphenylene Sulfide (PPS), Glass Filled (2)
- Polytetrafluoroethylene (PTFE) (28)
- Thermoplastic (14)
- Thermoplastic, Glass Filled (56)
- Thermoplastic, Polyester (39)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
-
- - (323)
- 100.0µin (2.54µm) (15)
- 15.0µin (0.38µm) (83)
- 150.0µin (3.81µm) (22)
- 180.0µin (4.57µm) (4)
- 196.9µin (5.00µm) (31)
- 20.0µin (0.51µm) (24)
- 200.0µin (5.08µm) (34)
- 25.0µin (0.63µm) (15)
- 29.5µin (0.75µm) (41)
- 30.0µin (0.76µm) (79)
- 5.00µin (0.127µm) (6)
- 50.0µin (1.27µm) (7)
- 500.0µin (12.70µm) (7)
- Flash (18)
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (4)
- 10 (2 x 5) (2)
- 10 (Round) (2)
- 11 (1 x 11) (1)
- 12 (1 x 12) (1)
- 13 (1 x 13) (1)
- 14 (1 x 14) (1)
- 14 (2 x 7) (12)
- 16 (1 x 16) (2)
- 16 (2 x 8) (14)
- 18 (1 x 18) (1)
- 18 (2 x 9) (8)
- 20 (1 x 20) (3)
- 20 (2 x 10) (16)
- 20 (4 x 5) (4)
- 22 (2 x 11) (8)
- 24 (2 x 12) (24)
- 261 (19 x 19) (1)
- 28 (1 x 28) (1)
- 28 (2 x 14) (15)
- 28 (4 x 7) (7)
- 3 (Oval) (32)
- 3 (Round) (2)
- 30 (1 x 30) (1)
- 32 (1 x 32) (9)
- 32 (2 x 16) (5)
- 32 (2 x 7, 2 x 9) (3)
- 36 (2 x 18) (3)
- 4 (1 x 4) (3)
- 4 (2 x 2) (4)
- 4 (Round) (5)
- 40 (2 x 20) (12)
- 44 (4 x 11) (4)
- 46 (1 x 46) (1)
- 5 (1 x 5) (2)
- 52 (4 x 13) (4)
- 6 (1 x 6) (1)
- 6 (2 x 3) (11)
- 64 (1 x 64) (3)
- 64 (2 x 32) (1)
- 68 (4 x 17) (4)
- 7 (1 x 7) (1)
- 8 (1 x 8) (3)
- 8 (2 x 4) (19)
- 8 (Round) (7)
- 84 (4 x 21) (4)
- 9 (1 x 9) (1)
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
273 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,269
In-stock
|
Harwin Inc. | CONNECTOR | D01-993 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder Cup | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 32 (1 x 32) | Brass | - | Brass | |||
|
|
VIEW |
1,472
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 4POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Tin | 4 (Round) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,977
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Gold | 30.0µin (0.76µm) | Nickel | 3 (Oval) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,925
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 50.0µin (1.27µm) | - | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,999
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Gold | 30.0µin (0.76µm) | Nickel | 3 (Oval) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,766
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Gold | 30.0µin (0.76µm) | Nickel | 3 (Oval) | Beryllium Copper | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,830
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Silver | 500.0µin (12.70µm) | - | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,681
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Copper | 3 (Oval) | Beryllium Copper | 100.0µin (2.54µm) | Beryllium Copper | |||
|
|
VIEW |
2,017
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Gold | - | Gold | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
3,724
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
3,340
In-stock
|
Harwin Inc. | CONN SOCKET SIP 46POS GOLD | D01-950 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 46 (1 x 46) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,881
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | 500.0µin (12.70µm) | Beryllium Copper | |||
|
|
VIEW |
2,188
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | 500.0µin (12.70µm) | Beryllium Copper | |||
|
|
VIEW |
1,020
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
|
VIEW |
3,037
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
3,389
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,036
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 50.0µin (1.27µm) | Silver | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,530
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Gold | 30.0µin (0.76µm) | Gold | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,882
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Gold | 3 (Round) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,654
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 8POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Tin | 8 (Round) | Copper Alloy | - | Copper Alloy | |||
|
|
VIEW |
2,750
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 10POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Tin-Lead | 10 (Round) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,410
In-stock
|
Amphenol FCI | CONN SOCKET PLCC 52POS TIN | - | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polyphenylene Sulfide (PPS) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Tin | 52 (4 x 13) | Phosphor Bronze | 150.0µin (3.81µm) | Phosphor Bronze | |||
|
|
VIEW |
2,091
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 24 (2 x 12) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,184
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
2,801
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Tin-Lead | 40 (2 x 20) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
1,773
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | - | Gold | 16 (2 x 8) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
1,933
In-stock
|
TE Connectivity AMP Connectors | CONN IC SIP SOCKET 8POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyester | 0.100" (2.54mm) | Gold | - | Tin-Lead | 8 (1 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,029
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 64POS GOLD | D73064 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, Staggered | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.050" (1.27mm) | Gold | - | Tin | 64 (2 x 32) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,547
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,573
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
