Contact Finish - Mating :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,518
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Aries Electronics CONN SOCKET SIP 20POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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1,529
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Aries Electronics CONN SOCKET SIP 20POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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3,201
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Aries Electronics CONN SOCKET SIP 20POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
20-0501-30
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3,417
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Aries Electronics CONN SOCKET SIP 20POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,197
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Aries Electronics CONN SOCKET SIP 20POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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3,097
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Aries Electronics CONN SOCKET SIP 20POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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2,373
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Aries Electronics CONN SOCKET SIP 20POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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1,471
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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927
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Aries Electronics CONN SOCKET SIP 20POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,427
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
346-43-120-41-013000
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3,988
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,368
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Aries Electronics CONN SOCKET SIP 20POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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1,907
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Aries Electronics CONN SOCKET SIP 20POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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3,490
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Aries Electronics CONN SOCKET SIP 20POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
346-93-120-41-013000
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1,970
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,176
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
714-93-120-31-018000
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1,331
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,026
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,821
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Aries Electronics CONN SOCKET SIP 20POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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3,244
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Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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1,630
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,781
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,151
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,144
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,954
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,332
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,128
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,100
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,954
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,514
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Aries Electronics CONN SOCKET SIP 20POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze